No-clean lead-free solder paste, high-reliability flux with high wettability and good solderability
The lead-free alloy powder of spheroidal and low-oxygen content of Sn96.5Ag3.0Cu0.5 is scientifically prepared. Can meet lead-free soldering
This product can be used with bare copper, gold plate, tin plate, OSP and other surface treated PCB and other lead-free solder alloys.
Pieces, in computer motherboards, mobile phone motherboards, MP3, MP4, communication equipment, audio and video equipment, refrigeration equipment, vehicle equipment, instrumentation
Widely used in watches, medical equipment and other high reliability, high quality electronic appliances.
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What are the solder paste SAC305, SAC307, etc.? ?
The composition of the solder paste is mainly composed of tin, silver and copper. S, A and C respectively represent tin-silver-copper, namely S:Sn; A:Ag; C:Cu.
SAC305 means that the percentage of these three metals is: 96.5% Sn, 3.0% Ag, 0.5% Cu;
SAC307 says that the percentages of these three metals are: 99% Sn, 0.3% Ag, 0.7% Cu.
Solder paste is formed by mixing solder powder, flux, and other surfactants, thixotropic agents, and the like. The general ratios are SN63/PB37, SN42BI58, SN96.5CU0.5AG3.0 (SAC305) and SN99CU0.7AG0.3 (SAC307).
The alloy composition of the tin/silver/copper system containing 0.5 to 1.5% Cu and 3.0 to 3.1% Ag has quite good physical and mechanical properties.