Lead Free Solder Paste

Lead Free Solder Paste

Lead-free solder paste flux with high performance
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Product Details

Introduction

Lead-free solder paste flux with high performance 

Operating characteristic

1.In continuous printing, the viscosity rarely changes with time, and a very stable printing effect can be obtained.
2.For circuits with 4.0mm and above spacing, fine print can be completed
3.Excellent weldability, Suitable wetness can be shown in different parts
4.Suitable for general atmospheric or nitrogen return welding furnace
5.At very high peak temperature, good weldability can also be obtained.

Composition and properties

project

character

alloy composition

Sn42Bi58

melting point

138℃

Tin particle size

20-45/um

Tin powder shape

spherality

metal content

89.5-91±1%

Halide Content

<0.05wt%

 viscosity

180±20Pa.s(Viscometet at 25℃)





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